AS4C256M16D3B-12BIN

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics:
  • High-density storage capacity
  • Fast data transfer rate
  • Low power consumption
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Bulk packaging, typically sold in reels or trays

Specifications

• Part Number: AS4C256M16D3B-12BIN
• Organization: 256 Megabit x 16
• Speed: 12ns
• Voltage: 1.5V
• Interface: Double Data Rate 3 (DDR3)
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The AS4C256M16D3B-12BIN has a total of 60 pins arranged in a specific configuration. The pinout diagram is as follows:

```

Pin Name Description

1 VDD Power supply 2 DQ0 Data input/output bit 0 3 DQ1 Data input/output bit 1 4 DQ2 Data input/output bit 2 ... 58 VSS Ground 59 NC No connection 60 VDDQ Power supply for I/O buffers ```

Functional Features

• High-speed data access and transfer
• Non-volatile storage capability
• Automatic refresh mechanism
• Error correction capabilities
• Support for multiple memory banks

Advantages

• Large storage capacity allows for storing vast amounts of data
• Fast data transfer rate enables quick retrieval and processing of information
• Low power consumption helps conserve energy
• Compact BGA package offers improved thermal performance and space efficiency

Disadvantages

• Relatively higher cost compared to other memory technologies
• Susceptible to data loss in case of power failure or system crashes
• Limited lifespan due to the finite number of write and erase cycles

Working Principles

The AS4C256M16D3B-12BIN is based on dynamic random access memory (DRAM) technology. It stores data in a matrix of capacitors, with each capacitor representing a single bit of information. To read or write data, the memory controller sends electrical signals to the appropriate rows and columns of capacitors, allowing the charge to be sensed or modified.

Detailed Application Field Plans

The AS4C256M16D3B-12BIN is commonly used in various electronic devices and systems that require high-speed and large-capacity memory, such as: - Personal computers - Servers - Networking equipment - Gaming consoles - Industrial control systems

Detailed and Complete Alternative Models

• AS4C128M16D3B-12BIN: 128 Megabit x 16 DDR3 memory module
• AS4C512M16D3B-12BIN: 512 Megabit x 16 DDR3 memory module
• AS4C256M32D3B-12BIN: 256 Megabit x 32 DDR3 memory module

These alternative models offer similar functionality and characteristics but differ in terms of storage capacity and pin configuration.

Word count: 309 words