Micron Technology Inc.
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MT29F4G16ABBDAH4:D

MT29F4G16ABBDAH4:D

Basic Information Overview

  • Category: Memory Device
  • Use: Data storage and retrieval
  • Characteristics:
    • Non-volatile
    • High capacity
    • Fast read/write speeds
  • Package: BGA (Ball Grid Array)
  • Essence: Flash memory chip
  • Packaging/Quantity: Individual chip

Specifications

  • Model: MT29F4G16ABBDAH4:D
  • Capacity: 4 gigabits (512 megabytes)
  • Interface: Parallel
  • Voltage: 3.3V
  • Access Time: 25 ns
  • Operating Temperature: -40°C to +85°C
  • Endurance: 100,000 program/erase cycles

Detailed Pin Configuration

  1. VCC
  2. A0
  3. A1
  4. A2
  5. A3
  6. A4
  7. A5
  8. A6
  9. A7
  10. A8
  11. A9
  12. A10
  13. A11
  14. A12
  15. A13
  16. A14
  17. A15
  18. A16
  19. A17
  20. A18
  21. A19
  22. A20
  23. A21
  24. A22
  25. A23
  26. A24
  27. A25
  28. ALE
  29. CLE
  30. RE#
  31. WE#
  32. WP#
  33. R/B#
  34. CE#
  35. BYTE#
  36. NC
  37. DQ0
  38. DQ1
  39. DQ2
  40. DQ3
  41. DQ4
  42. DQ5
  43. DQ6
  44. DQ7
  45. DQ8
  46. DQ9
  47. DQ10
  48. DQ11
  49. DQ12
  50. DQ13
  51. DQ14
  52. DQ15
  53. VSS

Functional Features

  • High-speed data transfer
  • Block erase and program operations
  • Automatic page write and read
  • Error correction code (ECC) support
  • Power-saving features
  • Hardware data protection

Advantages

  • Large storage capacity
  • Fast read/write speeds
  • Low power consumption
  • Reliable data retention
  • Compact package size

Disadvantages

  • Limited endurance compared to other memory types
  • Higher cost per unit compared to some alternatives
  • Requires specific programming algorithms for optimal performance

Working Principles

MT29F4G16ABBDAH4:D is based on NAND flash memory technology. It stores data in a series of memory cells organized into blocks. Each cell can store multiple bits of information using multi-level cell (MLC) technology. The chip utilizes a combination of transistors and floating gate structures to trap and release electrons, representing binary data.

Detailed Application Field Plans

  • Solid-state drives (SSDs)
  • USB flash drives
  • Memory cards
  • Embedded systems
  • Consumer electronics
  • Industrial applications

Detailed and Complete Alternative Models

  1. MT29F4G08ABADAWP:A
  2. MT29F4G08ABADAH4:A
  3. MT29F4G08ABADAWP:B
  4. MT29F4G08ABADAH4:B
  5. MT29F4G08ABADAWP:C

(Note: These alternative models have similar specifications and functionality but may differ in package type or other minor details.)

This entry provides an overview of the MT29F4G16ABBDAH4:D flash memory chip. It includes basic information, specifications, pin configuration, functional features, advantages and disadvantages, working principles, application field plans, and alternative models.

Liste 10 almindelige spørgsmål og svar relateret til anvendelsen af MT29F4G16ABBDAH4:D i tekniske løsninger

Sure! Here are 10 common questions and answers related to the application of MT29F4G16ABBDAH4:D in technical solutions:

  1. Q: What is MT29F4G16ABBDAH4:D? A: MT29F4G16ABBDAH4:D is a specific model of NAND flash memory chip manufactured by Micron Technology.

  2. Q: What is the storage capacity of MT29F4G16ABBDAH4:D? A: MT29F4G16ABBDAH4:D has a storage capacity of 4 gigabytes (GB).

  3. Q: What is the interface used for connecting MT29F4G16ABBDAH4:D to other devices? A: MT29F4G16ABBDAH4:D uses a standard NAND flash interface, such as the Open NAND Flash Interface (ONFI) or Toggle Mode.

  4. Q: Can MT29F4G16ABBDAH4:D be used in embedded systems? A: Yes, MT29F4G16ABBDAH4:D is commonly used in various embedded systems, including smartphones, tablets, and industrial applications.

  5. Q: What is the operating voltage range of MT29F4G16ABBDAH4:D? A: MT29F4G16ABBDAH4:D operates at a voltage range of 2.7V to 3.6V.

  6. Q: Does MT29F4G16ABBDAH4:D support error correction codes (ECC)? A: Yes, MT29F4G16ABBDAH4:D supports built-in ECC functionality to ensure data integrity.

  7. Q: What is the maximum transfer rate of MT29F4G16ABBDAH4:D? A: MT29F4G16ABBDAH4:D has a maximum transfer rate of up to 200 megabytes per second (MB/s).

  8. Q: Can MT29F4G16ABBDAH4:D withstand extreme temperatures? A: Yes, MT29F4G16ABBDAH4:D is designed to operate reliably in a wide temperature range, typically from -40°C to 85°C.

  9. Q: Is MT29F4G16ABBDAH4:D compatible with different operating systems? A: Yes, MT29F4G16ABBDAH4:D is compatible with various operating systems, including Linux, Windows, and embedded real-time operating systems.

  10. Q: Are there any specific considerations for integrating MT29F4G16ABBDAH4:D into a design? A: It is important to ensure proper power supply, signal integrity, and adherence to the manufacturer's guidelines for layout and routing when integrating MT29F4G16ABBDAH4:D into a design.

Please note that the answers provided here are general and may vary depending on the specific requirements and use cases.