Aries Electronics
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24-6556-30
DataSheets

24-6556-30

CONN IC DIP SOCKET 24POS GOLD
Varenummer
24-6556-30
Producent/Mærke
Aries Electronics
Serie
6556
Del status
Active
Emballage
Bulk
Driftstemperatur
-
Monteringstype
Through Hole
Afslutning
Wire Wrap
Funktioner
Open Frame
Type
DIP, 0.6" (15.24mm) Row Spacing
Materiale til hus
Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Parring
0.100" (2.54mm)
Kontakt Finish - Parring
Gold
Kontakt Finish Tykkelse - Parring
30.0µin (0.76µm)
Kontakt Finish - Post
Tin
Antal positioner eller stifter (gitter)
24 (2 x 12)
Kontaktmateriale - Parring
Beryllium Copper
Pitch - Post
0.100" (2.54mm)
Kontakt Finish Tykkelse - Stolpe
200.0µin (5.08µm)
Kontaktmateriale - Post
Brass
Anmod om tilbud
Udfyld venligst alle påkrævede felter og klik på "SEND", vi kontakter dig om 12 timer via e-mail. Hvis du har problemer, bedes du efterlade beskeder eller e-mail til [email protected], vil vi svare hurtigst muligt.
På lager 12370 PCS
Kontakt information
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