Aries Electronics
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40-6554-10
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40-6554-10

CONN IC DIP SOCKET ZIF 40POS TIN
Varenummer
40-6554-10
Producent/Mærke
Aries Electronics
Serie
55
Del status
Active
Emballage
Bulk
Driftstemperatur
-
Monteringstype
Through Hole
Afslutning
Solder
Funktioner
Closed Frame
Type
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Materiale til hus
Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Parring
0.100" (2.54mm)
Kontakt Finish - Parring
Tin
Kontakt Finish Tykkelse - Parring
200.0µin (5.08µm)
Kontakt Finish - Post
Tin
Antal positioner eller stifter (gitter)
40 (2 x 20)
Kontaktmateriale - Parring
Beryllium Copper
Pitch - Post
0.100" (2.54mm)
Kontakt Finish Tykkelse - Stolpe
200.0µin (5.08µm)
Kontaktmateriale - Post
Beryllium Copper
Anmod om tilbud
Udfyld venligst alle påkrævede felter og klik på "SEND", vi kontakter dig om 12 timer via e-mail. Hvis du har problemer, bedes du efterlade beskeder eller e-mail til [email protected], vil vi svare hurtigst muligt.
På lager 13748 PCS
Kontakt information
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40-6554-10 Fotos
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